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- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
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- Flexible copper clad laminate
- Coverlay
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- Rigid Polyimide Material
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- Rigid Materials
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- HDI
- HDI
- UL File (Download)
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- Conventional FR-4
- Lead Free Compatible FR-4.0, FR-15.0
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- CEM-3, CEM-3.1
- CEM-1
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
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- Rigid Polyimide Material
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- Suzhou Shengyi
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- 225
- 410
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- 429
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- 3.8%
- 170
- 348
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- 145
- 330